Supports die and COC packaging formats
● 200 Gb/s (100 Gbaud under PAM4 modulation) per wavelength
● 5G wireless fronthaul and midhaul
● Data centers and AI computing, including 400G, 800G, 1.6T optical modules
● Complies with Telcordia GR468 standard
● Supports non-hermetic packaging, reducing application costs
● Supports LAN-WDM and CWDM4
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